Industry News

Wuerth Elektronik

Würth Elektronik eiSos presents its 2018 Product Catalog

New & Innovative Passive Components

Over 1000 pages long, the new “Passive Components 2018” catalog is now available from Würth Elektronik eiSos. The manufacturer of electronic and electromechanical components presents its broad and significantly extended range in the categories of EMC Components, Power Magnetics and Signal & Communications – some of which are AEC-Q200 qualified. All the products listed in the catalog are available from stock, also as free samples.


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TDK Corporation thumb

SMD pulse transformers for Gigabit Ethernet and PoE

TDK Corporation has expanded the ALT4532 series of pulse transformers with new types for Gigabit Ethernet and Power over Ethernet (PoE) applications. The new ALT4532P type is designed for emerging 2.5GBASE-T (2.5 Gbit/s) and 5GBASE-T (5 Gbit/s) LAN applications as well as 1000BASE-T (1 Gbit/s) applications with 600-mA PoE.


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Anritsu Company to Address High-speed Testing Requirements Associated with Emerging and Next-generation Technologies at DesignCon 2018

Anritsu Company (booth #741), a Diamond Sponsor of DesignCon 2018, will host a series of technical sessions and conduct live testing demonstrations that aid engineers in verifying emerging and next-generation high-speed designs during DesignCon 2018, to be held in Santa Clara, CA, January 30 – February 1, 2018. Among the technologies to be addressed by Anritsu will be PCI Express® (PCIe®), Thunderbolt, USB 3.0, 200G/400G PAM4, and 56G PAM4.


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Teledyne LeCroy Announces New PCIe® 4.0 Multi-Lead and MidBus Probes

DesignCon 2018 -- Teledyne LeCroy Inc., today announced the availability of new PCI Express PCIe 4.0 Multi-Lead (solder down) and MidBus Probes for its Summit™ PCI Express 4.0 Protocol Analyzers. Both the PCIe Multi-Lead and MidBus probes, when used with a PCIe 4.0 Protocol Analyzer, enable testing at up to x16 link widths at 16 GT/s speeds using Teledyne LeCroy's latest T.A.P4 technology.


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TE Connectivity enables future of 400GbE at DesignCon 2018

OSFP, QSFP-DD products support emerging ethernet standard

TE Connectivity (TE), a leader in connectivity and sensors, today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices.


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