We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
According to Yole Intelligence, part of Yole Group, in the Status of the Power Module Packaging Industry report, the power module market for xEV represented a market value of US $807 million in 2020 and will reach US $3.59 billion by 2026.
Anritsu Company enhances its VectorStar vector network analyzer (VNA) family with comprehensive spectrum analysis capability to create the world’s first single sweep VNA-spectrum analyzer solution that supports 70 kHz to 220 GHz.
Digi-Key Electronics announced that it now offers a selection of RockeTape, powered by Blueshift, a one-of-a-kind structured air thermal insulation tape for the world’s hottest and coolest spots, through its Fulfilled by Digi-Key program.
With the edgeAggregator, Softing offers a flexible, container-based solution for managing complex system architectures in OT/IT integration all the way to edge and cloud applications.
EDI CON Online, an interactive event that will be held online every Wednesday in October 2022, has announced its platinum sponsors, keynotes, and featured talk speakers.
Micron Technology, Inc. announced its plans to invest $40 billion through the end of the decade to build leading-edge memory manufacturing in multiple phases in the US.
Keysight Technologies, Inc. announced that Xiaomi has selected Keysight's 5G device test solutions to accelerate 5G Release 16 (Rel-16) device validation in support of the latest 3GPP 5G radio (NR) features and specifications.