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Zentech Manufacturing, Inc., announced the acquisition of Trilogy Circuits, LLC.

Infineon Technologies AG, is taking the next step towards smallest power supply devices for automotive electronics. As first chipmaker, the company set up a dedicated production process for flip-chip packages that is fully aligned with the high-quality requirements of the automotive market.

Keysight Technologies, Inc. announced that it will introduce the world's first design and test workflow solution that reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems at DesignCon 2020 (Booth 725).

TE Connectivity (TE) will educate and inspire system designers at DesignCon 2020 by demonstrating an array of solutions for next-generation compute and networking systems.

Keysight Technologies, Inc., and Silicon Labs announced a collaboration that streamlines the validation of timing solutions in the development of system-level designs for wireless communications, high-speed digital, medical imaging and automotive applications.

Epson and Rohde & Schwarz, announced their joint development of a modern test procedure for measuring power supply noise rejection to bring clarity and precision to real-world signal integrity design challenges.

Signal Microwave has launched a new line of higher performance edge launch connectors designed for the thinner substrates used today.

LCR Embedded Systems has released two VPX development and evaluation chassis for 3U and 6U systems. The DK3 and DK6 feature enhanced flexibility, fast conversion between air and conduction cooled module support, as well as fast backplane replacement.

Teledyne LeCroy announced the further development of its Teledyne Test Tools (T3)-branded portfolio of test equipment with the launch of the T3VNA1500 vector network analyzer (VNA).

Teledyne LeCroy, announces the availability of an open-source software tool, SignalIntegrity, offering free solutions to signal integrity problems for design and test engineers.