Industry News

cadence 3.20

Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Cadence Design Systems, Inc., announced that the release of the Cadence® digital full flow, with hundreds of completed advanced-node tape outs, has been enhanced to further optimize power, performance and area (PPA) results across a variety of application areas including automotive, mobile, networking, high-performance computing and artificial intelligence (AI).


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ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT

ACM Research, Inc., introduced the Ultra stress-free polishing (SFP) ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.


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Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability

Demand continues to grow for Silicon Carbide (SiC)-based systems to maximize efficiency and reduce size and weight, allowing engineers to create innovative power solutions. Applications leveraging SiC technology range from electric vehicles and charging stations to smart power grids and industrial and aircraft power systems.


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Nokia Bell Labs’ World Records in Fiber Optics to Enable Faster and Higher Capacity of 5G Networks of the Future

Nokia Bell Labs announced that its researchers have set the world record for the highest single carrier bit rate at 1.52 Terabits per second (Tbit/s) over 80 km of standard single mode fiber – the equivalent of simultaneously streaming 1.5 million YouTube videos – which is four times the market’s current state-of-the-art of approximately 400 Gigabits per second.


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