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The supply of high-quality silicon carbide wafers from Wolfspeed will pave the way for Renesas to scale production of silicon carbide power semiconductors starting in 2025.
The design is built around a Teledyne e2v QLS1046-Space edge computing module that is configured by the radiation-hardened 64MByte Infineon SONOS based NOR Flash memory, enabling high performance space processing applications.
With the successful validation of the industry’s first protocol conformance test cases for 3GPP Rel. 17 NTN NB-IoT, Rohde & Schwarz and MediaTek accelerate adoption of non-terrestrial network-based IoT use cases spanning multiple sectors.
Data from Omdia and 5G Americas indicates strong penetration in the North American market, even as new 5G network buildouts are accelerating around the world.
The acquisition allows Keysight to further expand its software prototyping capabilities into computer-aided engineering, enabling customers to accelerate time to market and lower operational costs while reducing their environmental footprint.
The new type of intelligent computing infrastructure is designed to address the computing power challenges associated with large-scale model computing.
YINCAE has announced the launch of its new innovative underfill material, which is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue.
Vishay Intertechnology, Inc. has introduced four new series of 200 V FRED Pt
ultrafast rectifiers in the low profile DFN3820A package with wettable flanks.
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