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Patented set of technologies unleashes GaN to operate at up to 20 MHz for the first time without overheating or RF issues, opening up a vast new application area for GaN.

According to a recently published report from Dell’Oro Group, the multi-access edge computing market has failed to materialize as expected, and we are lowering expectations by more than 20% for 2023. 

Abracon expands its line of high-performance ClearClock™ oscillators with the addition of the brand new AK2A and AK3A-series oscillators.

To provide long-distance and reliable USB solutions to the market, Microchip Technology announces two new reclocker/redriver devices. 

Transtector has released a new line of outdoor AC panel surge protectors with high-capacity metal oxide varistor technology.

Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE IEDM has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

Liquid Instruments, a leading innovator in software-defined instrumentation, announced the release of Moku Version 3.0 for its flexible, FPGA-based Moku:Pro, Moku:Lab, and Moku:Go products.

In their latest report, Yole Group delivers a comprehensive understanding of the technology and market trends, describes the underlying technologies, the supply chain that drives it, and its competitive landscape.

ZTE Corporation announced that its R5300 G5 server has shattered the world record in the SPEC CPU 2017 test, showcasing outstanding performance.

Flex Power Modules and Bear VAI Technology are coming together to offer and support the Flex Power Modules range of DC/DC conversion products in the Midwest U.S.