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The company will demonstrate its comprehensive portfolio of EMC test equipment, from advanced receivers and oscilloscopes to high-power amplifiers, antennas, and automation software.
Tokyo University of Science researchers unveil the critical role of growth temperature in sputter epitaxy of scandium aluminum nitride (ScAlN) films on GaN heterostructures.
YINCAE announced the launch of its next-generation liquid metal thermal interface material (TIM), engineered with enhanced viscosity properties to deliver exceptional performance, processability, and long-term reliability.
Samtec offers development and evaluation kits to ensure and validate that its interconnect products meet customers’ performance requirements. This includes military/aerospace applications and using COTS and open standards products.
The new range of X1/Y2 safety-certified multilayer ceramic capacitors offers more options for electrical engineers designing high-power, compact power electronics.
Teradyne, Inc. announces the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory devices, integrated with GPUs and accelerators in high-performance, generative AI servers.
Indium Corporation announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
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