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Socionext announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging.

The new component packages of the WE-CMDC series enable effective noise suppression at a rated current up to 10 A, making these compact filter components ideal for modern high-current applications.

Infineon has announced the strengthening of its existing collaboration with Delta Electronics, Inc., in the development of state-of-the-art high-density power modules capable of enabling vertical power delivery to AI processors in hyperscale data centers.

Yole Group releases its annual report, "Status of the Advanced Packaging Industry 2025," featuring exclusive market ranking and in-depth analysis of leading players.

According to a recently published report from Dell’Oro Group, the MCN market experienced robust growth of 19% Y/Y in 2Q 2025.

As gold partner for EMC Europe 2025 in Paris, Rohde & Schwarz will present a complete portfolio of solutions for EMC and field strength testing. 

TDK Corporation has expanded its PLEC69B series of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centers.

Infineon Technologies AG is expanding its CoolSiC™ MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems.

Rohde & Schwarz expanded its broadband amplifier portfolio of the R&S®BBA300 family with the two innovative amplifier series.

According to a recently published report from Dell’Oro Group, preliminary findings reveal that RAN market conditions continued to stabilize in the quarter.