Industry News

news 7.28

VadaTech Announces a Rugged, High Speed DSP Unit

Utilizing Xilinx VU13P With Integrated Layer 3 Managed Switch

VadaTech announces the VT971. The VT971 is a rugged conduction cooled unit which follows VITA 47 for environmental up to CC4/C3/V3/OS2. The unit accepts 32 high-speed SERDES to the Xilinx XCVU13P FPGA, which is supported by two 64-bit wide banks for DDR4 memory for the total of 16GB of memory.


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DesignCon Reveals Conference Content for the August 16-18 In-Person Event

DesignCon, the premier event in high-speed communications and system design, announced a fresh raft of speakers confirmed for the 2021 edition of DesignCon, set for August 16-18 at the San Jose McEnery Convention Center. This year's conference offers the DesignCon community access to expert-led sessions, panels, tutorials, and accredited education – both free and paid – exploring emerging trends across the global $1 trillion unit semiconductor market.


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PCB West Announces Exhibitors, Free Sessions

More than 100 leading industry suppliers for PCB design, fabrication and assembly are expected to exhibit at PCB West this fall, UP Media Group Inc. noted. The annual trade show will feature a who’s who of leading ECAD developers, printed circuit fabricators and assemblers, and other suppliers.


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