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Pixus Technologies has announced a 3-slot 3U OpenVPX backplane with an additional VITA 62 PSU slot. The OpenVPX 3U backplane has a BKP3-CEN03-15.2.9 VITA 65 profile. The 3+1 slot backplane is standardly designed to PCIe Gen3 speeds with options for higher levels. Pixus offers versions with mechanical mounting options for ATR enclosures and IEEE rackmount chassis platforms.
Xilinx, Inc., introduced the Versal™ HBM adaptive compute acceleration platform (ACAP), the latest series in the Versal™ portfolio. The Versal HBM series enables the convergence of fast memory, secure connectivity, and adaptable compute in a single platform.
Orolia has introduced EdgeSync, a cost-effective network timing platform that provides network time protocol (NTP) and precision time protocol (PTP) grandmaster and boundary clock functionality for real-time edge applications.
Thanks to many years of experience in testing probe cards, Seica has designed the PilotV8XL HR Next> series, which is the only flying probe that can offer a full turnkey solution for the Probe Card test.
SEGGER Microcontroller GmbH, announced a collaboration with Analog Devices, Inc. The collaboration between the two companies revolves around emNet, SEGGER’s IP stack, and the ADIN1110, Analog Devices' robust, low-power industrial 10BASE-T1L Ethernet MAC-PHY device.
Rohde & Schwarz takes its successful R&S RTO family to the next level with the all-new and redesigned R&S RTO6 oscilloscope featuring an updated UI on a 15.6 in. Full HD touchscreen.
Rohde & Schwarz introduces the next generation of its R&S RTO 6 GHz class oscilloscope. The R&S RTO6 digital oscilloscope offers six different bandwidth models from 600 MHz to 6 GHz and a sample rate of up to 20 Gsample/s.
Kandou introduced the first product from the Matterhorn™ family of USB-C® multiprotocol retimer solutions with USB4™ support and the only commercially available USB4 retimer to work across all system-on-chip (SoC) platforms.
Nordson Electronics Solutions, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing.
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