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ANSYS and Helic Sign Acquisition Agreement

Acquisition will complement ANSYS’ portfolio to enable next-generation products in 5G and artificial intelligence

ANSYS announced today that it has entered into a definitive agreement to acquire Helic, the industry-leading provider of electromagnetic crosstalk solutions for systems on chips (SoCs). By combining the Helix products with its own flagship electromagnetic and semiconductor solvers, ANSYS aims to provide a comprehensive solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. 


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EDI CON CHINA PREVIEW

EDI CON China 2019 Preview

EDI CON China 2019 announces a preview of the technical conference and opening of registration for this year’s conference and exhibition. The event returns to Beijing and the Chinese National Convention Center (CNCC) April 1-3.


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Rohde & Schwarz and Marvell Pioneer All Physical Layer Test Cases for 1000BASE-T1 Compliance

Test and measurement specialist Rohde & Schwarz and semiconductor manufacturer Marvell® have demonstrated all the 1000BASE-T1 compliance test cases for layer 1 (PHY). Using validated chipsets from Marvell and test equipment from Rohde & Schwarz, OEMs, Tier2, System Integrators and test houses can set up Automotive Ethernet networks that are fully compliant with 1000BASE-T1 specifications.


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