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Mouser Electronics, Inc., announces a global distribution agreement with Marvell Semiconductor, Inc., a provider of storage, processing, networking, security and connectivity semiconductor solutions.

Efficient Power Conversion (EPC) announces the EPC2051, a 100 V GaN transistor with a maximum R_DS(on) of 25 mΩ and a 37 A pulsed output current for high efficiency power conversion in a tiny 1.1mm² footprint.

TE Connectivity (TE), today introduced its new 124 position Sliver internal I/O connectors and cable assemblies, which provide a high density solution that enables up to x20 signal transmission lanes, or 40 differential pairs.

MACOM Technology Solutions Inc., today announced live demonstrations of the first complete chipset solution for 200G and 400G CWDM optical module providers servicing Cloud Data Center applications.

Now that Qualcomm’s multi-year effort to acquire NXP has been abandoned, the Dutch chipmaker is taking some of the $2 billion breakup fee it got to grow its core business.

Under the Syfer brand, the AEC-Q200 series of MLCC capacitors has had a range extension increasing the available working voltage from 2kV up to a maximum of 4kV.  Designed for EV applications where ever higher voltages are needed, but where a margin for derating has to be accommodated for - ideal for power train use, like battery management and invertors.

Advanced Thermal Solutions, Inc. (ATS), a thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce the addition of tvLYT™ to its line of liquid crystal and surface thermography systems.