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Altium LLC announced the launch of Nexar, the cloud-based partner platform designed to connect the rapidly growing community of Altium 365 PCB design users and their companies with the software, suppliers and manufacturers needed to transform ideas into smart and connected products.

Keysight Technologies, has expanded its Advanced Automotive Ethernet software portfolio to help automotive industry engineers, designers and manufacturers develop high-quality, high-performance products that improve safety in driving conditions and enable emerging advanced driver assistance systems (ADAS). 

Electronics industry sales and marketing expert, Lectrix announced an expanded marketing partnership with Schaffner EMV AG, building upon their existing partnership with Schaffner USA.

Keysight Technologies, Inc. announced that Semipower Electronic Technology has selected Keysight’s power device testing solutions to accelerate and promote the development of next-generation semiconductors.

Averatek Corporation announced Firan Technology Group (FTG) as an A-SAP™, an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, licensee.

Trackwise announced the appointment of Steve Hudson as Chief Operating Officer. He will support CEO Philip Johnston in executing the company’s strategy and vision as Trackwise expands to serve customers in its key verticals: automotive, aerospace and medical.

Richardson Electronics, Ltd., announces the FET-Jet calculator by UnitedSiC, an excellent tool to find the most optimized SiC device in the early stages of power design.

The K88 option for R&S RTO and R&S RTP oscilloscopes from Rohde & Schwarz enables compliance testing on the next evolution of the automotive Ethernet standard.

Rohde & Schwarz launched the R&S ZNA, the industry’s first purely touch-operated vector network analyzer, originally two years ago. These models cover frequency ranges of up to 50 GHz and 67 GHz.

Avishtec announced the availability of the latest version of its Gauss 2D Field Solver toolset with accurate insertion loss modeling that accounts for ground plane losses, new capabilities for broadband extraction of dielectric properties and conductor roughness parameters directly from S-Parameters and a higher level of accuracy and granularity.