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Purdue University engineers have addressed an issue barring the development of quantum networks that are big enough to reliably support more than a handful of users. The method could help lay the groundwork for when a large number of quantum computers, quantum sensors and other quantum technology are ready to go online and communicate with each other.
Artech House announced the publication PCB Design Guide to Via and Trace Currents and Temperatures by Douglas Brooks and Johannes Adam. A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current.
TeledyneSP Devices announced the release of ADQ32 and ADQ33—a fourth-generation modular data acquisition boards optimized for high-throughput applications.
Teledyne LeCroy introduced the CrossSync™ PHY interposers and software options, enabling the first ever link between an oscilloscope and a protocol analyzer to allow engineers to get a complete picture when testing the PCI Express (PCIe) interface standard.
Tektronix, Inc., in collaboration with Anritsu, introduced the PCI EXPRESS® 5.0 transceiver (Base and CEM) and reference clock solution, becoming the first company to offer early CEM fixtures for pre-compliance testing.
Amphenol Industrial Operations, now offers the high speed contact that can be implemented in Amphenol’s GT series connectors and used in hazardous environments. Quadrax contacts offer more reliable rail mass transit (RMT) application requirements on inter-vehicle connections and database applications than multi-pole connectors without individual shielding.
The Atomic Force Microscope (AFM) is an important tool in materials science and used for mechanical scanning of surfaces. The forces acting between the atoms of the surface and the tip of a nanoscopic needle are measured and calculated giving resolutions in the order of fractions of a nanometer.
The 2021 IEEE MTT-S International Microwave Symposium (IMS2021) and Microwave Week, the world’s largest event for RF and microwave technology will be presented in a hybrid format, comprised of in-person and virtual participation options.