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Nordson Electronics Solutions, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing.

Takaya’s APT-1600FD-SL Dual Sided Flying Probe test system for assembled PCBAs delivers both high speed and a larger testing area designed to accommodate large PCBAs for the emerging markets of 5G communications and BMS (Battery Management System) applications.

Cinch Connectivity Solutions announced the availability of Dura-Con^TM Micro-D Top Entry EMI Backshells through their distribution partners.

The differential high-speed data connector systems H-MTD®, H-MTD®+ and H-MTD®e developed by Rosenberger set standards for future vehicle network systems. H-MTD connectors can be used for frequencies up to 20 GHz, guarantee high-data transmission rates of up to 56 Gbit/s and are characterized by savings in installation space and weight.

Rohde & Schwarz and VIAVI Solutions have successfully accomplished high-speed data throughput end-to-end test of 5G NR eMBB. By achieving 7.5 Gbps, the two companies herald the age of high data throughput, showing that it is possible to validate very high data rate applications over a 5G network without performance compromises.

Tektronix, Inc. has announced its global 2021 Tektronix Innovation Forum will run June 16 through July 16, 2021, offering attendees the opportunity to learn about industry developments, trends and innovations across the test and measurement industry.

Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules. The standard touts a host of crucial performance improvements and power savings over its predecessor, and anticipation has been high since the official announcement of its release.

Menlo Microsystems, Inc.'s virtual Switch Summit, June 16 & 17, will showcase MEMS switching technologies that are on the forefront of innovation for today’s electrification needs and tomorrow’s future.

The collaboration will augment the DesignSpark website with the SnapEDA search engine, allowing engineers to discover and design-in millions of electronic components through free CAD models that are compatible with nearly all major PCB design tools.

EDI CON Online, an interactive event that will be held online every Wednesday in August 2021, has announced its platinum sponsors and keynote speakers. In its third year, the event’s lineup of technical sessions, workshops, and keynote presentations will occur at no cost to attendees and will be available live with Q&A sessions or on demand after the event.