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eSilicon, a provider of FinFET ASICs IP platforms and 2.5D packaging solutions, in collaboration with Wild River Technology, announced today at DesignCon 2019 the availability of a test system that addresses the signal integrity demands of 56/112G PAM4 operation.

Keysight Technologies, Inc. announced a comprehensive transmitter (Tx) and receiver (Rx) testing solution that is designed to provide the speed and margins needed to meet the Peripheral Component Interconnect or PCI Express® 5.0 Technology (PCIe® Gen5) standard.

ANSYS is introducing improved ease of use and new functionalities in its newly released ANSYS^® 2019 R1, including ANSYS Fluent^®  and  ANSYS Motion^™. ANSYS 2019 R1 aims to enable engineers at every level to develop innovative products across a multitude of industries.

Keysight Technologies, Inc. announced the first comprehensive double data rate (DDR) 5.0 test solution. The DDR5 testing system includes a new receiver, transmitter, and protocol test solutions. It is designed to  perform all test requirements in the DDR5 design specification.

Molex announces a collaboration with Ixia, a Keysight Business, in a joint demonstration at DesignCon 2019 on January 30^th and 31^st at booth 631.

Samtec Inc., will showcase and demonstrate their latest high-performance interconnect and technologies at DesignCon 2019 in Santa Clara, CA.

HUBER+SUHNER will showcase its latest developments which guarantee these properties at DesignCon 2019, 30-31 January, Santa Clara.

SiSoft today announced new Signal Integrity, SerDes, and Mixed-Signal design solutions developed jointly with MathWorks which will be on display this week at DesignCon.

Keysight Technologies, Inc. announced PathWave Memory Designer, a new double data rate (DDR) memory simulation capability that is part of PathWave Advanced Design System (ADS) 2019.

Rogers Corporation will return to DesignCon in Santa Clara, CA (at booth #421) and show the XtremeSpeed™ RO1200Ô laminates and RO4000® products used in multi-layer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.