Industry News

Teledyne LeCroy Announces New PCIe® 4.0 Multi-Lead and MidBus Probes

DesignCon 2018 -- Teledyne LeCroy Inc., today announced the availability of new PCI Express PCIe 4.0 Multi-Lead (solder down) and MidBus Probes for its Summit™ PCI Express 4.0 Protocol Analyzers. Both the PCIe Multi-Lead and MidBus probes, when used with a PCIe 4.0 Protocol Analyzer, enable testing at up to x16 link widths at 16 GT/s speeds using Teledyne LeCroy's latest T.A.P4 technology.

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TE Connectivity enables future of 400GbE at DesignCon 2018

OSFP, QSFP-DD products support emerging ethernet standard

TE Connectivity (TE), a leader in connectivity and sensors, today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices.

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te connectivity

TE Connectivity and Credo pave the way for 112G single lane connectivity

Live demonstration for the first time at DesignCon 2018

TE Connectivity (TE), a world leader in connectivity and sensors, and Credo, a provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies.

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Carlisle Interconnect Technologies Unveils CoreHC™ and Card Edge Connectors at DesignCon 2018

Carlisle Interconnect Technologies (CarlisleIT), a division of Carlisle Companies (CSL), is exhibiting at the upcoming DesignCon 2018 Expo in Santa Clara, CA, Jan. 31–Feb. 1, 2018 in booth #648. CarlisleIT is introducing an updated CoreHC™ interconnect solution and brand-new Card Edge Connectors contact system as part of its integrated line of high-performance microwave cables and precision RF and high-speed digital connectors for Test & Measurement applications.

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