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Indium Corporation announced its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional experience based on their individual career goals and interests.
Indium Corporation announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free, and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, where topics will include sustainability, assembly processes, and EV electronics.
Indium Corporation will feature its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing at IPC APEX EXPO 2024.
Indium Corporation will introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany.
