With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, Calif., U.S.

Among its featured products, Indium Corporation will showcase its lead-free Durafuse technology and industry-proven Indium8.9HF solder paste series: 

  • Durafuse HR: Based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C), and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength. 
  • Award-winning Durafuse LT: A novel solder paste alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
  • Indium8.9HF Solder Paste Series: An industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance and improve stability during the printing process for high-reliability automotive electronics.

Some of the additional Rel-ion and high-reliability products for power electronics featured at IPC APEX will include:

  • Indalloy®301 LT Alloy for Preforms/InFORMS®: A novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. 
  • Award-winning InFORMS®: Reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. 
  • InTACK®: A no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. 
  • QuickSinter®: A new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. 
  • Durafuse HT: A novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free paste, presenting the merits of both constituent alloys. 
  • Heat-Spring®: A compressible, non-reflow metal TIM ideal for TIM2 applications. 

 Visit Indium Corporation experts at booth 4227.