Articles Tagged with ''AI''

Yole Group publishes its new report, "Data Center Semiconductor Trends 2025," offering an in-depth analysis of how AI, HPC, and hyperscaler demand are driving a new semiconductor paradigm.

Yole Group publishes its Power Electronics for Data Centers 2025 report, revealing how power availability, AI servers, and WBG technologies are reshaping data center architecture.

NI Nigel AI Advisor will transform how engineers approach test and measurement, cutting through complexity and accelerating workflows.

Pixus Technologies has a new design offering for carriers and specialty cards for AI computing, test & measurement, and other high performance computing systems.

The acquisition combines leaders in silicon design, IP and simulation and analysis to enable customers to rapidly innovate AI-powered products.

According to a brand-new AI RAN Advanced Research Report published by Dell’Oro Group, AI RAN is projected to account for approximately a third of the RAN market by 2029.

The future of signal integrity design is being reshaped by AI and machine learning. Traditional SPICE and IBIS models are giving way to generative AI, digital twins, and physics-informed models that offer real-time insights and future-proofing capabilities. Chris Cheng discusses why AI is no longer just data-driven—it’s becoming physics-aware, adaptable, and ready to co-pilot your next design.

Infineon collaborates with NVIDIA for industry-first 800 V power delivery architecture for AI data centers.

By 2030, IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.

Infineon announced that its OptiMOS 6 80V power MOSFETs in a compact 5x6 mm² dual side cooling package have been integrated into the IBC stage of an AI server platform of a leading processor manufacturer.