We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
By 2030, IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
Infineon announced that its OptiMOS 6 80V power MOSFETs in a compact 5x6 mm² dual side cooling package have been integrated into the IBC stage of an AI server platform of a leading processor manufacturer.
Astera Labs, Inc. announced that its purpose-built PCIe 6 connectivity portfolio is ramping production to fast-track deployments of modern AI platforms at scale.
Designed for AI workloads and hyperscale data center environments, the new 1.6T and 800G PICs enable breakthrough levels of performance, density, and power efficiency.
Designed to deliver the highest optical measurement sensitivity and integrated clock recovery up to 120 GBaud, the instruments specifically target the rigorous demands of 1.6 T transceiver optical testing for R&D and manufacturing of next-generation optical interconnects for data centres AI clusters.
AMD Versal AI Edge XQRVE2302 becomes the second radiation-tolerant device in the space-grade Versal adaptive SoC portfolio to be qualified for spaceflight, having achieved Class B qualification.
IDTechEx's report, "Hardware for HPC, Data Centers, and AI 2025-2035: Technologies, Markets, Forecasts", critically assesses the key developments and trends in memory and storage technologies.
The comprehensive BBU roadmap includes power solutions from 4 kW up to the world’s first 12 kW battery backup unit. The BBU solutions are designed to deliver highly efficient, reliable, and scalable power conversion in AI server racks.
