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August 15, 2017

Sponsored by: EDI CON USA

EDICON USA

 
Grounding

Ground Rules for Grounding

By Eric Bogatin

Ground is NOT a current return path. Read on to see Todd Hubing’s four rules of effective grounding strategy.

SI/PI Measurement

SI/PI Measurement Lab Shows How To Make Critical Measurements

By Janine Love

If you want help measuring things, there’s no cheaper way to do it than this! Find out how to get involved.

IBIS_EDI CON 2017

EDI CON USA Adds IBIS Summit to Its Premier Program Line-Up

IBIS summits promote exchanges of ideas and methods among users and developers of IBIS models and associated tools. The IBIS Open Forum Calls for Participation and Presentations at EDI CON USA, see the details.

EDICON USA

Dr. Eric Bogatin, Editor of Signal Integrity Journal will chair the High-Speed Digital Symposium. This special event requires a conference pass. Use code AUGUST to save 60% and pay only $200 for a three-day pass.
 

REGISTER NOW

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Anritsu

Thunderbolt™ 3 and USB Type-C: Testing in the Fast Lane

By Anritsu Company

This article delves into the emerging test and measurement challenges at a time when signaling frequency and data speed continue to rise in both Thunderbolt™ and USB 3.1 interconnect domains.

 


Signal Integrity Webinar

Upcoming Webinars

CST

High-Speed Digital Field Visualization of Currents and Crosstalk

Learn how to use visualization of electromagnetic fields, currents and power flow in the interconnect design. Understand where currents and power flow in uniform interconnects, what happens if reference conductors are compromised, and how traces and viaholes become coupled.

Anritsu and Samtec

Test, Measurement, and Analysis of PAM4 Signals Signal Integrity Webinar
 

Get an introduction to the nuances of PAM4 signaling and techniques for evaluating if PAM4 is necessary for a given system in addition to test techniques for evaluating PAM4 signals and the performance of PAM4 receivers.


ANSYS

Bridging the Electro-Thermal Divide Webinar
 

This webinar will discuss electro-thermal design solutions to problems resulting from increased power densities in electronic products. But in order for these solutions to actually work, Electrical and Mechanical Engineers need a better way to design and collaborate so that electronic products are robust and meet reliability specifications.

Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.

Browse webinars here.

The preceding is from Signal Integrity Journal™, owned by Horizon House Publications Inc., at 685 Canton St., Norwood, MA, 02062, USA. We are online at www.signalintegrityjournal.com and are also available at 781-769-9750. Copyright © 2017. All Rights Reserved. Your email address has not been given to any Third Parties. You have been selected to receive this email because you opted-in to receive information when you provided your email address to Signal Integrity Journal™. To ensure deliverability of emails from Signal Integrity Journal™, we recommend that you whitelist our domain address: mwjournalemails.com.

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