On January 24, 2023, Teledyne LeCroy announced the extension of their patented CrossSync™ PHY technology to USB4® signaling over USB Type-C® connectors. CrossSync PHY enables waveforms from Teledyne LeCroy oscilloscopes to be viewed alongside protocol analyzer traces, with complete time-correlation of electrical and protocol information for easy and powerful validation and root-cause analysis.
USB4 transfers data at higher speeds and delivers more power than previous generations of USB. To accomplish this, USB4 devices undergo negotiation with the host after connection to establish the fastest possible data transfer between the host and the device. The full 40 Gb/s data transfer over a USB Type-C cable is only achieved upon successful completion of a series of link negotiation steps between the host and device. The failure to complete the necessary steps results in link negotiation failures and downgrading of the maximum data transfer speed. These failures are difficult to debug because the failures could be electrical (PHY) related, protocol (Logic) related, or a combination of both (PHY-Logic). System integration engineers need to use both oscilloscopes and protocol analyzers together to debug PHY-Logic layer and link negotiation problems. Teledyne LeCroy’s previously released TF-USB-C-HS high-speed test coupon fixture enabled probing of USB signals by both the oscilloscope and protocol analyzer. Now, it is possible to connect the separate information sets from the oscilloscope and the protocol analyzer to a single analysis application, permitting simultaneous assessment of USB-C PHY layer and protocol logic layers.
CrossSync PHY technology enables Teledyne LeCroy’s oscilloscope user interface to be viewed directly alongside the industry-standard Teledyne LeCroy CATC® protocol trace. The USB4 CrossSync PHY software option permits the oscilloscope and protocol analyzer traces to be triggered, viewed, navigated, and analyzed in a time-correlated way unique to Teledyne LeCroy – quickly identifying problems in a live link and speeding time-to-market for new devices.