Rogers Corporation will return to DesignCon in Santa Clara, CA (at booth #421) and show the XtremeSpeed™ RO1200Ô laminates and RO4000® products used in multi-layer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.
DesignCon is a premiere event for electronic design engineers working on circuit and system levels, now in its 24th year. Held at the Santa Clara Convention Center, the event takes place January 30th thru the 31st.
Visitors to Rogers’ booth will be able to learn more about:
XtremeSpeed RO1200 Laminates
XtremeSpeed RO1200 high speed, extremely low loss laminates, with a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these laminates are well suited for the most demanding high layer count applications.
As channel speeds rise to 112Gbps and beyond, hardware designers need high performance circuit materials with superior electrical properties for applications like Network Infrastructure, High Performance Computing, and Test & Measurement. XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs and enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.
RO4000 Products for Multi-Layer Structures:
Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multi-layer designs. RO4835T™ laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835™ laminates when thinner cores are needed.
RO4450T™ 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through-hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
Lastly, CU4000™ and CU4000 LoPro® Foils are sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.