Items Tagged with 'AI'

Orbital is building and operating AI data centers in space, using solar power and radiative cooling to remove the energy and cooling constraints that limit terrestrial AI infrastructure. 

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. 

As currents increase and voltage rails shrink, managing fluctuations becomes a critical challenge. While probe noise is a major factor, the common-mode noise induced by the ground loop between the high-current DUT and the oscilloscope is often the more dominant disruptor in high-current AI environments. This experiment proves that simply switching oscilloscope vendors will not solve the problem. Read on to learn why the solution lies in the probing chain.

Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio.

The Wireless Broadband Alliance announced its new report, "AI/ML for Wi-Fi: Enabling Scalable, Intelligent Wi-Fi Ecosystems."

Keysight has announced its new graphics double data rate 7 transmitter compliance solution, that accelerates validation of Joint Electron Device Engineering Council standards for graphics and AI applications. 

The Cadence^® ChipStack AI Super Agent is the world’s first agentic workflow for automating chip design and verification.

Keysight has announced SOS Enterprise, an advanced edition of its engineering data management platform. The solution builds on the SOS Core software and automates engineering data governance and traceability to prepare for AI adoption at scale.

Emerson announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite.