Molex has announced the results of a global reliability survey that reveals the challenges facing system architects and design engineers for hardware, including devices, when balancing growing expectations for reliability with ever-increasing product complexity, diminishing time for testing, and constant cost and manufacturing constraints.
Portfolio of products designed to support tech leaders, hyperscale data center, and enterprise customers to meet increasing demands of generative AI, ML, 1.6T networking, and other high-speed applications.
Molex has acquired core technology and intellectual property from Keyssa Inc., accelerating Molex’s strategy to further expand and diversify its micro connector portfolio with highly flexible, cable-free connectors for near-field, device-to-device applications.
What are the greatest technical challenges facing connector designs for future high-speed deployments?Jairo Guerrero of Molex delves into the technical challenges for today’s connectors, the influence of applications such as automotive and data/telecom, and he gives an intriguing glimpse into the product development process at Molex.
This spring, Molex and Samtec announced a collaboration on next-generation data center solutions. SIJ caught up with Brian Vicich of Samtec, Inc and Brent Hatfield of Molex to find out what that means for engineers.