Items Tagged with 'Molex'

New product portfolio with more than 250 configurations and countless customization options ensures optimal signal integrity and electromagnetic compatibility.

Innovative mating technique resolves the problems with intermittent power delivery and signal interruptions inherent in traditional MMCX connectors.

Molex has introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet unrelenting demand for generative AI and machine learning workflows. 

Molex has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.

Molex continues to build on its automotive industry expertise with the introduction of its MX-DaSH family of data-signal hybrid connectors that unify power, signal, and high-speed data connectivity in a single connector system.

Molex has announced the results of a global reliability survey that reveals the challenges facing system architects and design engineers for hardware, including devices, when balancing growing expectations for reliability with ever-increasing product complexity, diminishing time for testing, and constant cost and manufacturing constraints.

Portfolio of products designed to support tech leaders, hyperscale data center, and enterprise customers to meet increasing demands of generative AI, ML, 1.6T networking, and other high-speed applications.

Molex has acquired core technology and intellectual property from Keyssa Inc., accelerating Molex’s strategy to further expand and diversify its micro connector portfolio with highly flexible, cable-free connectors for near-field, device-to-device applications.

What are the greatest technical challenges facing connector designs for future high-speed deployments?Jairo Guerrero of Molex delves into the technical challenges for today’s connectors, the influence of applications such as automotive and data/telecom, and he gives an intriguing glimpse into the product development process at Molex.

This spring, Molex and Samtec announced a collaboration on next-generation data center solutions. SIJ caught up with Brian Vicich of Samtec, Inc and Brent Hatfield of Molex to find out what that means for engineers.