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High-speed cable assemblies are available with 50 Ω ribbonized coax cable, or differential 100 Ω twinax cable. Assemblies include high-density arrays, systems with integral ground planes, hermaphroditic, rugged Edge Rate®, high-speed PCI Express® systems, and future-proof assemblies to design-in copper with the ability to upgrade to optical with the same PCB interconnects.
High-speed board-to-board systems are rated at 28+ Gbps and come in a variety of design options, including low profile Q-Strip® interconnect systems with an integral ground/power plane, available in 0.50, 0.635, and 0.80 mm pitch. Q2™ is a rugged system with increased insertion depth for rugged applications. Edge Rate® strips incorporate rugged Edge Rate Contacts which are less prone to damage when zippered during unmating.
Samtec High-Density Arrays are designed to maximize density, bandwidth, and routing flexibility. Popular SEARAY™ interconnects are available with up to 500 I/Os or 125 differential pairs. The rugged Edge Rate® contact system is less prone to damage when zippered during unmating. The SEARAY .8mm system is 2x the density of standard SEARAY.
Samtec’s x4 duplex 28 Gbps FireFly™ optical engine (ECUO Series) brings its industry-leading density to the 100 Gbps Datacom/Telecom and HPC markets. Designed with thermal optimization in mind, options are available for both forced air and cold plate cooling scenarios.
Samtec’s 0.635 mm pitch, high-speed, multi-row strip - packages the same reliable contact system and ease of processing found in the SEARAY™ family in an even smaller and higher-density strip design.
ExaMAX® high-speed backplane system (EBTM/EBTF-RA Series) enables 28 Gbps performance on a 2.00 mm column pitch with a roadmap to 56 Gbps. This rugged system has the industry’s lowest mating force with excellent normal force, a 2.4 mm contact wipe and two points of contact for high reliability.
Samtec’s flyover QSFP28 cable assembly (FQSFP Series) achieves 28 Gbps performance and is backward compatible with all QSFP assemblies. This direct attach system, with press-fit tails that provide low speed signals and power to the PCB, allows drivers to be remotely located for design flexibility and greater control over thermal cooling.
Samtec, a privately held $662 million global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of their extensive line of standard and custom AccliMate™ Sealed Cable Plugs and Receptacles, including new crimp sealed bayonet latching circulars. These systems meet IP67/IP68 requirements for dustproof and waterproof sealing and are designed for industrial, outdoor, underwater and other harsh environments.
Samtec will participate in the DesignCon 2017 conference and exhibition at the Santa Clara Convention Center, January 31 - February 2. Samtec’s Director of Signal Integrity Jim Nadolny will be presenting a 45-minute technical paper session covering “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.”
Samtec, a privately held $625 multi million global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications.
High-speed cable assemblies are available with 50 Ω ribbonized coax cable, or differential 100 Ω twinax cable. Assemblies include high-density arrays, systems with integral ground planes, hermaphroditic, rugged Edge Rate®, high-speed PCI Express® systems, and future-proof assemblies to design-in copper with the ability to upgrade to optical with the same PCB interconnects. 
High-speed board-to-board systems are rated at 28+ Gbps and come in a variety of design options, including low profile Q-Strip® interconnect systems with an integral ground/power plane, available in 0.50, 0.635, and 0.80 mm pitch. Q2™ is a rugged system with increased insertion depth for rugged applications. Edge Rate® strips incorporate rugged Edge Rate Contacts which are less prone to damage when zippered during unmating. 
Samtec High-Density Arrays are designed to maximize density, bandwidth, and routing flexibility. Popular SEARAY™ interconnects are available with up to 500 I/Os or 125 differential pairs. The rugged Edge Rate® contact system is less prone to damage when zippered during unmating. The SEARAY .8mm system is 2x the density of standard SEARAY.
Samtec’s x4 duplex 28 Gbps FireFly™ optical engine (ECUO Series) brings its industry-leading density to the 100 Gbps Datacom/Telecom and HPC markets. Designed with thermal optimization in mind, options are available for both forced air and cold plate cooling scenarios. 
Samtec’s 0.635 mm pitch, high-speed, multi-row strip - packages the same reliable contact system and ease of processing found in the SEARAY™ family in an even smaller and higher-density strip design.
ExaMAX® high-speed backplane system (EBTM/EBTF-RA Series) enables 28 Gbps performance on a 2.00 mm column pitch with a roadmap to 56 Gbps. This rugged system has the industry’s lowest mating force with excellent normal force, a 2.4 mm contact wipe and two points of contact for high reliability.
Samtec’s flyover QSFP28 cable assembly (FQSFP Series) achieves 28 Gbps performance and is backward compatible with all QSFP assemblies. This direct attach system, with press-fit tails that provide low speed signals and power to the PCB, allows drivers to be remotely located for design flexibility and greater control over thermal cooling.
