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High Density Multiport 1G/10G Ethernet Switch Testing Made Easy

GL Communications Inc. announced today its insight into Testing High Density Multiport  1 Gigabit/ 10 Gigabit Ethernet Switches for Functionality, Throughput and related parameters using GL’s Integrated multi interface Rackmount (mTOP™) Test Platform and HD PacketExpert™ 10GX a versatile Ethernet based Testing Tool.


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TE Connectivity

TE Connectivity Introduces High Density Card Edge Power Connectors

New connectors deliver highest current density in the market with unique dual-layer contact design

TE Connectivity (TE), introduces its new high density plus (HD+) card edge power connectors, which delivers the highest current density of any card edge power connectors. Capable of supporting power supplies up to 3kW, these connectors are designed to enable systems with increasing power requirements in next-generation data centers.


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