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Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers new 3U OpenVPX backplane configurations in 2, 3, 6, 13, and 16 slot versions per the VITA 65 specification.

The latest addition to the POLATIS all-optical switch portfolio from HUBER+SUHNER has been designed to provide operators with 80% more capacity than any other solution on the market.

Qualcomm Technologies, Inc. announced the latest addition to its growing connected car technology portfolio, Snapdragon Auto 5G Modem-RF Gen 2, the most advanced automotive modem-RF system offered by the company. 

Operators are leading a variety of investments around XR, using the cross-device and open ecosystem Snapdragon Spaces XR Developer Platform as the foundation.

New 5G Americas’ white paper provides a detailed update on the momentum of Open RAN.

March 14-16 event in Nuremberg, Germany, to include nine MIPI presentations.

Spirent’s annual report shows focus on autonomous testing, service experience and service assurance.

Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.

New pTLA to offer industry-best combination of size, affordability, and performance to meet the demand for 100G coherent at the edge.

Launched by Infineon Technologies AG, the new SEMPER Nano NOR Flash memory is optimized for battery-powered, small-form-factor electronic devices.