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The extremely low 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.
Rohde & Schwarz will showcase its latest solutions and advanced techniques for testing and analyzing power electronic systems and components at PCIM Expo 2025 in Nuremberg, Germany.
Innodisk announces the launch of its latest PCIe Gen5 SSD series, designed to meet the OCP Data Center NVMe SSD spec v2.0 and the increasing demands of AI model training, big data analytics, and data-intensive environments.
Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency.
Logic semiconductors play a huge role in the devices we use every day. As technology moves forward, new challenges and innovations will shape how these semiconductors perform and what they can do.
Liquid Instruments has announced the appointment of two new board members, Nobel Prize-winning physicist Professor Brian Schmidt and Liquid Instruments’ co-founder, Danielle Wuchenich.
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