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Verizon, along with Ciena, and Juniper Networks, have recently completed a test in Verizon’s live fiber network to move 800 Gbps of data on a single wavelength. 5G promises blazing fast gigabit speeds, super low single-digit millisecond latency, and huge scalability.
Black Box, introduced SFP+ 10-Gbps and QSFP+ 40-Gbps Direct Attach Cables (DACs), designed to provide premium, cost-effective, and error-free performance for data, storage, and high-performance computing interconnectivity.
At EMV 2020 in Cologne, Germany, Rohde & Schwarz will present EMC test solutions specifically for users in the automotive industry: the fastest CISPR-25 certification, a strong and compact BCI test system, and R&S AdVISE version 5, which keeps a close eye even on vibrating display elements during EMS tests.
Marvell and Analog Devices, Inc. announced a technology collaboration regarding Marvell’s 5G digital platform and ADI’s wideband RF transceiver technology to deliver fully optimized solutions for 5G base stations.
Pico Technology Ltd announces the PicoScope 6000E Series FlexRes® oscilloscopes, featuring 8 channels with 500 MHz bandwidth, 16 digital channels, and resolution of 8, 10 or 12 bits.
For any test and measurement application requiring up to four independent DC power supplies with full flexibility, full functionality, full safety and full connectivity, the R&S NGP800 power supply series will boost the efficiency in any lab or production line. Users benefit from the large 5” high resolution touch screen, which also displays detailed statistics.
Ensuring signal integrity is one of the main challenges in high-speed designs, digital transmission in the range of several Gbps is characterized by the introduction of jitter and noise into the signal. What appears at the receiving end does not match the intent at the transmission end when there is any degree of jitter and noise.
Istvan Novak, Principle Signal and Power Integrity Engineer at Samtec, Inc., was awarded DesignCon 2020’s Engineer of the Year at DesignCon, North America’s largest chip, board, and systems conference and exhibition.
DuPont Electronics & Imaging and SCHMID Group announced that they have entered into a nonexclusive joint development agreement to explore PCB plating applications to bring advanced changes to their global customers.
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