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Richardson RFPD, Inc. announced the availability and full design support capabilities for a family of silicon carbide semiconductor devices from Wolfspeed, a Cree Company.

EDI CON China 2020 will provide a forum for engineers to share their expertise and discuss new design methodologies with colleagues during this year’s conference.

HUBER+SUHNER, debut its LISA Double Access solution for the first time at ECOC 2019, as part of its Fiber Connectivity portfolio.

The EMI receiver families TDEMI® of GAUSS INSTRUMENTS® provide a huge fully CISPR compliant real-time bandwidth and therefore allow to speed up your measurements tremendouosly and to reduce the measurement uncertainty significantly - both at the same time.

TE Connectivity (TE), introduced its PCIe Gen 4 card edge connectors, which meet industry PCI-SIG Card Electromechanical (CEM) specification 4.0 and support Intel and AMD next-generation platforms with up to 16 Gbps of bandwidth.

Cadence Design Systems, Inc. expanded its presence in the system analysis and design market with the introduction of the Cadence^® Celsius Thermal Solver, the first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures.

Spectrum Instrumentation has released an optional module for its latest range of 16-bit digitizers and AWGs that adds 16 synchronous digital lines to the analogue data.

Analog Devices, Inc., announced a simple power solution that maximizes efficiency and minimizes electromagnetic (EM) emissions of motion systems as customers migrate to higher density automation.

TE Connectivity (TE), introduced its STRADA Whisper R backplane connectors, which make future data center system upgrades easier. A newly-optimized footprint helps ensure low crosstalk noise and enables the migration path from 56G PAM-4 to 112G PAM-4.