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Nanosecond-level clock synchronization can be an enabler of a new spectrum of timing- and delay-critical applications in data centers. However, the popular clock synchronization algorithm, NTP, can only achieve millisecond-level accuracy. Current solutions for achieving a synchronization accuracy of 10s-100s of nanoseconds require specially designed hardware throughout the network for combatting random network delays and component noise or to exploit clock synchronization inherent in Ethernet standards for the PHY.

TE Connectivity (TE), today introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers.

Dialog Semiconductor plc, today unveiled its new 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit to support sensor connectivity in the Internet of Things (IoT). Built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), the kit allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.

TE Connectivity (TE), today introduced its new right angle cabled STRADA Whisper backplane connectors, the first right angle cabled backplane connectors that are primarily used to connect graphics processing unit (GPU) to GPU within a switch or server, these connectors save valuable space and allow designers to fit inside an enclosure with the right angle cabled design.

Pasternack has launched a new line of skew matched cables for use in high-speed digital tests of 10 Gbps to 28 Gbps, including differential signals, bit-error-rate testing and eye diagrams. 

Imec, today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.  This achievement is an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems.