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Kandou officially opened its Silicon Glen office in East Kilbride, Scotland. The latest Kandou facility can accommodate more than 20 employees in product, test, packaging, and quality engineering and supply chain roles.
DesignCon announced the event's return to Santa Clara, CA, with an esteemed keynote lineup leading the way for the 2022 edition of the conference and exhibition.
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, announced it has completed the expansion project at its Circleville, Ohio manufacturing site.
Kandou announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn™ USB-C® multiprotocol retimer with USB4™ support.
Nation states will ramp up mobile cyber-attacks; hyperscalers will mimic Google and introduce powerful proprietary encryption protocols; and the latest edge clouds could make the last mile vulnerable.
Tektronix, Inc., announced the launch of its latest version of the award-winning 5 Series mixed signal oscilloscope, the 5 Series B MSO delivers more versatility while continuing to provide high-fidelity waveforms, spectrum analysis capabilities and flexible signal access.
BAE Systems has been awarded a $60 million contract from the Army Contracting Command – Rock Island under the Cornerstone Other Transaction Authority to develop certain types of next-generation, RHBD microelectronics, leveraging Intel Foundry Services.
Menlo Micro has introduced a high-power single-pole/four-throw (SP4T) DC-to-18 GHz switch that provides the industry’s highest performance, reliability, and integration for RF switching applications.
The Pico Technology serial decoders team have been working overtime, adding anotherprotocol to both PicoScope 6 (Stable) and PicoScope 7 (Early Access).
PCI-SIG®, the organization responsible for the widely adopted PCI Express® (PCIe®) standard, announced the official release of the PCIe 6.0 specification, reaching 64 GT/s.
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