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Z-zero announced today the launch of two new software products —Z-planner, for PCB stackup design and materials selection; and Field Solver Sandbox, for quick, accurate impedance and insertion–loss results. Z-planner is a field-solver based PCB stackup planning and materials selection tool that’s optimized for hardware engineering teams that may or may not be familiar with the exhaustive details of the laminate and PCB-fabrication processes.

ZTE Corporation (0763.HK / 000063.SZ), a major international provider of telecommunications, enterprise and consumer technology solutions for the Mobile Internet, announced it became the exclusive supplier of beyond 100G Optical Transport Network (OTN) project of Telefonica Mexico Movistar (TMM) in Mexico City, Guadalajara and Monterrey.

NI (Nasdaq: NATI), the provider of platform-based systems that enable engineers and scientists to solve engineering challenges, announced today a new PXI FlexRIO architecture that integrates mezzanine I/O modules with Xilinx Kintex UltraScale FPGAs.

Ardent Concepts, Inc., a leading designer and manufacturer of high performance, controlled impedance connectors used in the development of next generation semiconductor applications, has released a dual-ended version of its 70 GHz high density TR Multicoax connector.

Passive Plus, Inc. (PPI) offers Custom Capacitor Assemblies for high power requirements. Typical assemblies are configured in series and/or parallel combinations, producing higher voltage/current handling capabilities, extended capacitance range and tighter tolerances.

At the international VDI Congress ELIV (Electronics In Vehicles) in Bonn, Germany (October 18-19, 2017), Maxim Integrated Products, Inc. (NASDAQ: MXIM) will demonstrate how it empowers automotive design innovation through unique mixed signal and analog solutions for the car of the future. Designing tomorrow’s vehicles calls for technology that keeps up with increasing demands for greater safety and connectivity.

The International MegaGauss Science Laboratory, part of the Institute Solid State Physics (ISSP) at the University of Tokyo, is attempting to set a new world record for the highest ever, indoor magnetic field. To do this, the ISSP needed to improve the precision of the firing processes with sub-nanosecond measurements and has installed a Spectrum Instrumentation digitiser to achieve this.

Passive Plus, Inc. (PPI) offers a line of Hi-Q Capacitors available in 5 larger case sizes. Specifically produced for high power / high frequency requirements, these products are available in surface mount or leaded configurations that are 100% RoHS compliant and are also available in a Non-Magnetic termination.

Samtec announces the release of a new low-profile PCI Express^® edge card connector featuring Edge Rate® contacts for optimized signal integrity. The connector is PCI Express^® Gen 4 compliant and supports one, four, eight and sixteen links for different bandwith requirements.