Articles Tagged with ''design''

In the high-speed connector design arena, there are two opposing ideas. For some people, if you simply put pieces of plastic and metal together, eventually you have a signal transmission. This process is very simple. On the other end of the spectrum, there is the idea that a solid connector design requires a deep understanding of electromagnetic theory, a wisdom only sorcerers and wizards possess.

Engineers invest tens to hundreds of thousands of dollars in signal integrity simulation software—the goal being to gain an accurate understanding of how signals are going to behave in the final product. But how do you do that early in the design process without reliable, verifiable electrical properties for the dielectrics incorporated into your design?

My friend Steve Sandler pointed out a major hurdle we face in power distribution design: power engineers (who design power converters) and power integrity engineers (who design system bypassing-decoupling networks) use different vocabulary, techniques, and requirements. To understand a little better how we got here, I want to start with a prediction I heard sometime in the early 90s at one of the conference keynote speeches: “In 10 to 20 years, computers will look like hairy steamy golf balls.” 

My aging vibration system started faulting. Shaking for 30 years takes a toll on a thing, after all. The system is pretty straightforward, just a big stack of audio amps and a controller. Much to my lab manager’s chagrin, I had been intentionally ignoring the warning signs.

Last night, at EDI CON China 2018, the conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.

Keysight is offering a free seminar to help high-speed digital design engineers, SI and PI engineers, and design team managers, learn the skills they need to overcome signal integrity (SI) and power integrity (PI) challenges.

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Analog Devices, Inc., the leading global high-performance analog technology company, announced a scalable Silicon Carbide (SiC) driver reference design solution based on a range of Microsemi SiC MOSFET products and Analog Device's ADuM4135 5KV isolated gate driver. The dual SiC MOSFET driver reference design provides user-friendly design guides enabling faster time to market for customers using Microsemi SiC MOSFETs and supports the transition to Microsemi's next generation SiC MOSFETs.