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At DesignCon 2018, the IEEE P370 standards group announced the release of two important tools to assist all engineers for de-embedding. In the presentation by Jason Ellison and Heidi Barnes, “A NIST Traceable PCB Kit for Evaluating the Accuracy of De-Embedding Algorithms and Corresponding Metrics,” the two new tools were announced, a board kit and a de-embedding software tool. These two tools are the first series of products released as open source from the P370. Expect more in the next year.
Mentor, a Siemens business, announced its new HyperLynx® printed circuit board (PCB) simulation technology for high-performance designs, now providing the industry’s first end-to-end fully automated serializer/deserializer (SerDes) channel validation solution. Learn more.
Rohde & Schwarz offers T&M equipment that covers all areas of wireless communications, from component tests to mobile network test solutions. Special T&M equipment for the automotive industry as well as cybersecurity solutions will also be on display.
By CST
Lead frame packages are an established packaging technology for many types of applications, due to their manufacturing and cost advantages. Download the white paper.
DesignCon 2018 featured a 14-track conference covering the latest developments in hardware and high-speed communications design with over 100 technical sessions, three full day boot-camps, and more. The keynote presentations included NASA's New Horizons mission, the safety of autonomous vehicles and expert predictions of future challenges within engineering (panel session), and more.
This presentation proposes using a pulse echo for time domain reflectometry (TDR) rather the commonly used step function echo. The echoed pulse response of a single symbol is convolved with the modulation signal levels to produce an effective reflection coefficient metric at a specified bit error ratio (BER). Learn more.
Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience. Browse webinars here.
