Lead frame packages are an established packaging technology for many types of applications, due to their manufacturing and cost advantages. When the limits of this technology are pushed, careful analysis of these packages using state-of-the-art design and simulation tools becomes essential. This technical white paper describes a workflow of rapid design and simulation for lead frame packages using CAD Design Software’s (CDS) Electronics Packing Designer (EPD) software, and CST® STUDIO SUITE®.

Download the white paper here