Kyocera Corporation and Vicor Corporation will collaborate on next-generation power-on-package solutions to maximize performance and minimize time-to-market for emerging processor technologies, the companies announced. As a part of the collaboration, Kyocera will provide the integration of power and data delivery to the processor with organic packages, module substrates and motherboard designs. Vicor will provide power-on-package current multipliers enabling high density, high current delivery to processors. This collaboration aims to address the rapid growth of higher performing processors, which has created proportionate growth and complexity in high-speed I/Os and high current consumption demands.
Vicor’s power-on-package technology enables current multiplication within the processor package, allowing for higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up to 90 percent, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality. Vicor’s technology enables vertical power delivery (VPD) from the bottom side of the processor. The company reports that VPD virtually eliminates power delivery network (PDN) losses while maximizing I/O capability and design flexibility.
Kyocera’s proprietary solutions to optimize processor performance and reliability are based on decades of experience in package, module and motherboard manufacturing for customers worldwide. Kyocera has cultivated design expertise by applying Vicor'sdevices in multiple applications. By utilizing its design technology, simulation tools and manufacturing experience, Kyocera provides optimal designs for complex I/O routing, high speed memory routing, and high-current power delivery. Through collaboration, Kyocera and Vicor plan to bring new solutions for AI and high-performance processor applications to market.