Electronic Products, Inc. (EPI), a full-service, “powder-to-package” electronic device packaging designer and manufacturer, has announced increased capability to resolve various optoelectronic package challenges at Photonics West in Booth #5461 at the Moscone Convention Center in San Francisco, CA February 5-7th.

Recently merging with Semiconductor Enclosures, Inc., EPI is now a single-source for a wide range of high-quality, hermetic glass-to-metal seal, and multi-layer ceramic package solutions. With their engineering and prototype development lab and full manufacturing lines under one roof, EPI is developing optical packages with the smallest footprint while offering high environmental stability and low optical insertion loss. Applications include ceramic-based Pill packages for VCSEL, LEDs, and a variety of sensing elements.

Additional optoelectronics packaging advancements include ceramic-based optical TO-header packages that enable more complex circuit patterns than standard glass-to-metal seals. EPI is also developing solutions for large, multilayer, high I/O, aluminum nitride (AlN) substrates for next-generation focal plane arrays.

Optical packages EPI is now routinely delivering standard and custom solutions for include:
• TO Headers
• Components
• Sensors
• Substrates
• Windows
• Lenses