Items Tagged with 'IC'

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as co-packaged optics, including full support by Cadence design tools to the stacked platform technology.

The extremely low 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.

Renesas Electronics Corporation has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC.

Allegro has announced the launch of the third product in its High Voltage Power-Thru portfolio.

As the use of smart devices continues to expand and the Internet of Things gains traction, the demand for interface bridge ICs is projected to experience substantial growth in the foreseeable future.

Infineon Technologies AG introduces the MOTIX TLE9140EQW gate driver IC for brushless DC motors targeting the demanding 24/48 V market.

Siemens Digital Industries Software announced that its Calibre nmPlatform tool for IC design verification and its  Analog FastSPICE Platform are now both certified for Intel 18A and Intel 16 process technologies.

Headlining the release is the NPS4053, a high density IC designed to provide a smaller footprint and superior system protection to help increase system reliability and ensure safety.

The new TLE988x and TLE989x families offer higher performance and now feature CAN (FD) as the communication interface.

To meet the latest design and application needs, Infineon Technologies AG introduces the next generation of the EiceDRIVER product family of dual-channel galvanically isolated gate driver ICs.