Items Tagged with 'data centers'

Orbital is building and operating AI data centers in space, using solar power and radiative cooling to remove the energy and cooling constraints that limit terrestrial AI infrastructure. 

According to Research Intelo, the global electromagnetic compatibility (EMC) testing for data centers market was valued at USD 1.2 billion in 2024 and is projected to reach USD 2.6 billion by 2033, expanding at a robust CAGR of 8.7 percent.

The collaboration focuses on the joint design, optimization, and validation of a modular 2-5 megawatt SST building block.

Infineon supports the 800 VDC power architecture announced by NVIDIA at Computex 2025 for AI infrastructure. A shift to a centralized 800 VDC architecture allows for reduced power losses, higher efficiency and reliability. However, the new architecture requires new power conversion solutions and safety mechanisms to prevent potential hazards and costly server downtimes.

With the expansion of its power protection portfolio Infineon supports the growing requirements for power path protection solutions for current and future high-power AI server ecosystems ranging from 48 V to +/-400 V and 800 V. 

Alpha Networks Inc. announced the launch of its newly developed 1.6T liquid-cooled switch equipped with the Broadcom Tomahawk 6 chip to deliver up to 102.4 Tbps of switching capacity. It is optimized for AI data centers, cloud applications, and next-generation networks with high energy efficiency and advanced cooling.

Infineon Technologies AG introduces a 12 kW reference design for high-performance power supply units, specifically designed for AI data centers and server applications.

The collaboration provides customers with extended product availability and supply flexibility to a portfolio of robust, scalable connectivity solutions for a wide range of high-performance applications demanding high signal integrity and density.

Infineon has announced the strengthening of its existing collaboration with Delta Electronics, Inc., in the development of state-of-the-art high-density power modules capable of enabling vertical power delivery to AI processors in hyperscale data centers.

TDK Corporation has expanded its PLEC69B series of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centers.