Items Tagged with 'ML'

The Wireless Broadband Alliance announced its new report, "AI/ML for Wi-Fi: Enabling Scalable, Intelligent Wi-Fi Ecosystems."

This article describes the use of Cadence’s Sigrity signal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.

Keysight has announced the release of the new Machine Learning Toolkit in the latest Keysight Device Modeling Software Suite. This new solution reduces model development and extraction time from weeks to hours, enabling faster Process Design Kit delivery and Design Technology Co-Optimization applications.

Spirent has integrated its high-density optical switching solution with Velocity Automation Portfolio to maximize operational efficiency and resiliency, and optimize AI/ML connectivity.

New ASA ML v1.1 compliance test software and high definition oscilloscopes enable deployment of autonomous vehicle technologies.

The future of signal integrity design is being reshaped by AI and machine learning. Traditional SPICE and IBIS models are giving way to generative AI, digital twins, and physics-informed models that offer real-time insights and future-proofing capabilities. Chris Cheng discusses why AI is no longer just data-driven—it’s becoming physics-aware, adaptable, and ready to co-pilot your next design.

The need for speed will be the driving force behind energy production and efforts to make increasingly efficient use of available energy. Eric Bogatin reflects upon the evolution of power resources from the Industrial Revolution to today’s generation of AI and network processors.

Unlike traditional MPUs, the PIC64HX is purpose built to address the unique demands of intelligent edge designs.

Samtec will demonstrate next-generation, high-performance optical and copper interconnect solutions at the upcoming ECOC exhibition.

Since woven glass PCB substrates are anisotropic, EDA design and modeling software hoping to advance AI and ML algorithms should have provisions to model anisotropic material, especially via transitions. In this article, Bert Simonovich discusses the importance of having an awareness of the test method used by CCL suppliers for accurate modeling and simulation. Simonovich covers how the use of out-of-plane Dk_z values instead of in-plane Dk_xy values for via modeling can cause misleading simulation results, which may result in reduced margins and potential compliance test failures when the design is built and tested.