Items Tagged with 'memory'

Introspect Technology announced that it has shipped the M5512 GDDR7 Memory Test System, the world’s first commercial solution for testing JEDEC’s newly minted JESD239 GDDR7 SGRAM specification.

The collaboration sees Signal Edge Solutions appointed as a exclusive distributor of EKH-EyeKnowHow products in the U.S., further solidifying its commitment to delivering top-tier measurement solutions to the electronics industry.

In the final installment of his article series "DDR5 Electrical and Timing Measurement Techniques," Randy White explores how following a standard workflow for setting up thresholds and timings to distinguish bursts in DDR5 memory interfaces can make design validation much more efficient, ultimately ensuring compliance with specifications and improving system margin by identifying and resolving any issues, especially those related to either read or write transactions.

Optimizing DDR5 memory system validation involves a strategic focus on probe and interposer solutions for in-system measurements. The selection of probe architecture, whether RC or RCRC, plays a key role in managing probe loading. To make the right choice, evaluating source impedance and signal characteristics, especially for bursted signaling, is essential. As DDR5 continues to evolve at higher speeds and reach its top speed phase, integrating non-ideal loading modeling within simulations and effectively de-embedding probe and interposer effects become critical components of a comprehensive testing plan.s

Offering a 50% increase in performance, Micron extends leading-edge 1β technology to power server and PC applications.

Aitech Systems has released the S993, a radiation-tolerant 3U CompactPCI memory card that provides up to 1 TB of on-board storage Space NAND flash with all 8 NAND modules installed for a variety of space applications. 

Launched by Infineon Technologies AG, the new SEMPER Nano NOR Flash memory is optimized for battery-powered, small-form-factor electronic devices.

Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.

Teledyne e2v semiconductors’ ultra-high density DDR4 memories continues, now that flight models are being shipped to key customers around the world and is now moving into the mass production phase, with the space-grade radiation tolerant DDR4s being available.
 

The paper discusses the development of GDDR6 as a lower-risk and more cost-effective solution as compared to other high-bandwidth memory solutions.