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UMC has announced a licensing agreement with imec for the transfer of imec’s iSiPP300 silicon photonics process, featuring CPO compatibility, to accelerate UMC’s silicon photonics roadmap.
Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as co-packaged optics, including full support by Cadence design tools to the stacked platform technology.
Researchers have found that glass-epoxy-based waveguides have characteristics that make them ideal for transmitting optical signals in co-packaged optics.
IDTechEx's recent report examines how CPO technology can enhance data center efficiency and shape infrastructure to allow for more powerful computing systems, and predicts the total CPO revenue to reach $1.2 billion by 2035, growing at a CAGR of 30% from 2025.
IDTechEx's independent report, "Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts," offers an extensive exploration into the latest advancements within co-packaged optics technology.
IDTechEx's report analyzes key technical innovations and packaging trends, evaluates major industry players, and provides detailed market forecasts, highlighting how CPO adoption will transform future data center architecture.