Items Tagged with 'YINCAE'

A breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.

At the event, YINCAE will highlight TM 150LM liquid metal thermal interface material in combination with LA 150 rubber sealant, a material system designed to deliver low thermal impedance while significantly reducing mechanical stress on chips.

YINCAE is proud to announce the release of UF 66L, a next-generation OCU engineered for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules, and advanced flip-chip assemblies where optical clarity, thermal endurance, and reliability are critical.

YINCAE announced the launch of its next-generation liquid metal thermal interface material (TIM), engineered with enhanced viscosity properties to deliver exceptional performance, processability, and long-term reliability.

With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules. 

YINCAE has announced the launch of its new innovative underfill material, which is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue.

YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product Thermal Underfill - UF 158A2.