To help developers implement SiC solutions and fast-track the development process, Microchip Technology introduces the 3.3 kV XIFM plug-and-play mSiC gate driver with patented augmented switching technology, which is designed to work out-of-the-box with preconfigured module settings to significantly reduce design and evaluation time.
The decarbonization trend will result in strong market growth for power semiconductors, in particular those based on wide bandgap materials. Infineon Technologies AG is now taking a further, decisive step to shape this market by significantly expanding its Kulim fab.
The automotive-graded SiC MOSFET generation offers high power density and efficiency, enables bi-directional charging, and significantly reduces system cost in on-board charging and DC-DC applications.
Next-generation SiC diodes combine high surge current robustness with low forward voltage drop, capacitive charge, and reverse leakage current to increase efficiency and reliability in switching power designs.
To provide BEV and HEV designers with a faster, more reliable high-voltage circuit protection solution, Microchip Technology has announced the E-Fuse Demonstrator Board, enabled by SiC technology, available in six variants.
IDTechEx's new report "Semiconductors for Autonomous and Electric Vehicles 2023-2033" finds that the coming mass adoption of electric vehicles will drive a 10-year CAGR of 20.9% in semiconductors used for electric powertrains.