Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last year's success, the Committee is looking forward to the 23rd Edition which will convene in the French Alpes, in the charming town of Chambery, on the shores of the Bourget lake.