Signal Integrity Journal Online Panel Series

Title: Online Panel: High Speed Interconnect Technologies

Date: August 19, 2026

Time: 8am PT / 11am ET

Sponsored by: Samtec, Quantifi Photonics, Molex and Amphenol Communications Solutions

Panel Participants: Tim Rainear (Microwave Journal® - moderator), Sandeep Sankararaman (Samtec), Dr. Klaus Engenhardt (Quantifi Photonics), Gus Panella (Molex), and Kasthuri Sankar Damodharan (Amphenol Communications Solutions)

Abstract:
High-speed interconnect technologies are pushing the limits of signal integrity, bandwidth density, and power efficiency across data centers, AI hardware, advanced packaging, and next-generation communications systems. This online panel brings together industry experts to examine the latest innovations in materials, architectures, simulation, and measurement techniques enabling multi-gigabit and terabit data rates. Topics will include electrical and optical interconnect trends, chiplet and 3D integration impacts, loss mitigation strategies, and the evolving challenges of design validation at extreme speeds.

Moderator: Tim Rainear, Technical Editor, Microwave Journal®
Panelist: Sandeep Sankararaman, Technologist, Samtec
Panelist: Dr. Klaus Engenhardt, Director of Technology and Business Development Broadband Portfolio, Quantifi Photonics
Panelist: Gus Panella, Director, Interconnect Engineering, Molex
Panelist: Kasthuri Sankar Damodharan, Solutions Architect, Amphenol Communications Solutions


Panel Participant Bios:

Moderator – Microwave Journal

Tim Rainear, Technical Editor

Tim Rainear is a veteran of the semiconductor industry with over 40 years in sales and business development. He began his sales career as an application engineer for Siemens Components (now Infineon), where he supported a wide range of devices, from LEDs and optocouplers to power MOSFETs and telecom ASICs. He spent the next decade in the digital domain working for LSI Logic and two FPGA start-ups. From there, he progressed to the RF world, holding Director of Sales positions at TriQuint and later Amplifier Research. For the last 15 years, Rainear has worked as Area Sales Director for CML Micro, supporting key accounts in the mil/aero and satcom industries with GaAs and GaN MMIC solutions. Rainear has a BSEE from the University of Cincinnati and an MBA from Temple University.

Samtec

Sandeep Sankararaman, Technologist

Sandeep has 20+ years of experience in signal and power integrity for IC packages, PCBs, PCB connectors, and connectors for cable assemblies.

Quantifi Photonics

Dr. Klaus Engenhardt, Director of Technology and Business Development Broadband Portfolio

Dr. Klaus Engenhardt is currently Director of Technology and Business Development Broadband Portfolio at Quantifi Photonics and has over 20 years’ experience working at the leading edge of test and measurement.

He was previously the Principal Technology Lead and Program Manager for Integrated & Silicon Photonics at Keysight Technologies, and held the roles of Chief Technology Officer (EMEA), and Principal Engineer and System Architect for high-speed electro-optical test instrumentation at Tektronix Inc., where he was also acknowledged for enabling a tier-1 customer to bring silicon-photonics technology to market.

He received his Ph.D. in Physics from the University of Oregon and has been a regular participant in international standards and industry organizations (OIF, IEEE, EPIC), and maintains a strong interest in the advancement of Integrated Photonics as a technology platform for communication applications.

Molex

Gus Panella, Director, Interconnect Engineering

Augusto Panella is Director of Interconnect Technology at Molex. He is an industry veteran with over 35 years of R&D experience. His knowledge about data integrity, signal integrity, power integrity, and hardware architectures coupled with a system solution vision have made him a trusted source of interconnect technology for top companies in the industry. In his role with the Molex team, he is responsible for advancing fundamental innovations of the physical layer required for next-generation interconnects targeting Generative AI, Machine Learning, Switching, and High-Performance Computing.

Amphenol Communications Solutions

Kasthuri Sankar Damodharan, Solutions Architect

Kasthuri (Kash) Sankar Damodaran is a Solutions Architect at Amphenol, specializing in aligning customer platform topology goals with advanced connectivity technologies. Kash works closely with engineering teams to translate system requirements into optimized copper and optical interconnect solutions. His expertise includes product design, testing and qualification, signal integrity, thermal considerations, and functional performance across a wide range of hardware platforms.

He holds a B.S. in Mechanical Engineering from Kongu Engineering College (affiliated with Anna University) and a Master’s degree in Manufacturing and Mechanical Systems Integration from the Rochester Institute of Technology (RIT), Rochester, New York.

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