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Demystifying High-Performance Computing to Reduce Time to Market

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When

7/27/23 11:00 am to 12:00 pm EDT

Event Description

Signal Integrity Journal Webinar Series

Title: Demystifying High-Performance Computing to Reduce Time to Market

Date: July 27, 2023

Time: 8am PT / 11am ET

Sponsored by: Keysight Technologies

Presented by: Rajath Narasimha, HPC Cloud Product Manager, Keysight Technologies

Abstract:
Electronic designs are exponentially becoming more complex, and ensuring that they meet specs within shrinking project timelines is quickly turning into a daunting task.
High-performance computing (HPC) uses supercomputers and parallel processing to solve complex problems in less time and with higher accuracy. It combines parallelism with access to unlimited computing and storage infrastructure, enabling design engineers to simulate all aspects of the design, reduce board revisions, and bring them to market faster than ever. In this webinar, you will learn how to:

  • Expedite your simulation workflow with HPC with no knowledge prerequisites.
  • Leverage parallelism to simulate design aspects and reduce board revisions.
  • Integrate HPC with an EDA Tool for an 80% reduction in your simulation time.

Presenter Bio:
Rajath Narasimha is an HPC Cloud Product Manager under the PathWave Software Solutions business at Keysight Technologies in Santa Clara, California.

He is responsible for setting the strategies, roadmaps, release priorities and launch plans for cloud portfolio products at Keysight inside within the PathWave organization.

During his career, Rajath has held previous product management positions spanning several industries like wireless, semiconductors, EDA, and Cloud.

He holds a master’s in electrical engineering from San Francisco State University and is a certified AI/ML and Cloud practitioner from the University of California, Berkeley, and a certified Product Manager from Product School.

Please note:
By registering for this webinar, the details of your profile may be used by Signal Integrity Journal™, the presenter, and the sponsor to contact you by email.